JS-A23 is a novel flame retardant specifically developed for epoxy adhesives. When used in combination with DOPO or ADP flame retardants, it exhibits excellent synergistic effects, showing stable UL 94-V0 at very low dosage. Additionally, JS-A23 makes it easier to mix and disperse all components. The FR epoxy resin adhesive product maintains excellent mechanical, electrical, and processing properties.
| Materials | Dosage (g) |
|---|---|
| AC | 75.00 |
| 4,4-DDS | 54.90 |
| 580K70 | 46.68 |
| 901A80 | 36.30 |
| 128E | 30.36 |
| Modified epoxy resin | 45.36 |
| 710A65 | 2.64 |
| BF3·MEA | 5.94 |
| ATH | 45.60 |
| Talcum | 12.15 |
| Formula A (g) | Formula B (g) | Formula C (g) | Formula D (g) | |
|---|---|---|---|---|
| Formula | ADP system | ADP system | DOPO system | DOPO system |
| JS-A23 | 1.92 | 2.06 | ||
| ADP | 9.92 | 5.13 | ||
| MCA | 0.64 | 2.06 | ||
| DOPO | 14.02 | 8.25 | ||
| Total | 9.92 | 7.69 | 14.02 | 13.37 |
Dissolve the BF3·MEA complex of triborane (BF3·MEA) into 15g acetone, then add JS-A23. Put the mixture into the epoxy adhesive solution and stir. Then add alumina (ATH) filler, talcum powder (Talcum), and various flame retardants (ADP, MCA, DOPO). Adjust the stirring speed to 1500 rpm and mature for 2 hours to obtain a milk yellow liquid. The GT time and viscosity of this liquid are as follows.
| Formula A | Formula B | Formula C | Formula D | |
|---|---|---|---|---|
| Adhesive solution GT/s | 201 | 252 | 198 | 288 |
| Viscosity η/cPs | 1000+ | 547 | 1000+ | 471 |
Glass fiber cloth was used cut as the carrier. The solution was spread evenly with a brush, and then a piece of glass fiber cloth was placed on it. Then pour solution again, and the cloth was spread evenly with a brush and left to stand. When the solution completely soaked the glass fiber cloth, the second piece was placed on it. This operation was repeated until seven pieces of glass fiber cloth were soaked in the solution.
The seven layers of glass fiber cloth were separated and hung vertically on the drying rack, placed in an oven for baking. The parameters of the oven were set according to the gelation time /GT of the adhesive solution. The GT time and the mixing effect are as follows.
| FormulaA | FormulaB | FormulaC | FormulaD | |
|---|---|---|---|---|
| Adhesive solution GT/s | <10 | 100 | <10 | 76 |
| Mixing effect | good | good | good | good |
| Simple or not | simple | simple | very hard | simple |
Six semi-cured sheets were separated and molded in pairs. Polyimide film was used as a demolding protective film to get CCLs.
| FormulaA | FormulaB | FormulaC | FormulaD | |
|---|---|---|---|---|
| Thickness /mm | 0.40 | 0.44 | 0.48 | 0.40 |
| Content/% | 48.3 | 45.3 | 46.4 | 48.9 |
| UL94 | V0 | V0 | HB | V0 |
| Formula A | Formula B | Formula C | Formula D | |
|---|---|---|---|---|
| Tg1/℃ | 142 | 154 | - | 134 |
| Tg2/℃ | 156 | 153 | - | 153 |
| Thickness | Properties | Unit | Test | Standard | FormulaB | FormulaD |
|---|---|---|---|---|---|---|
| 0.16mm | Mini breakdown voltage | kV | A | ≥45 | 79 | 75 |
| D-48/50 | ≥40 | 82 | 78 | |||
| Dielectric constant @ 1 MHz | - | A | ≤5.20 | 5.07 | 5.18 | |
| D-24/23 | ≤5.40 | 5.38 | 5.36 | |||
| Max dissipation coefficient @ 1 MHz | - | A | ≤0.025 | 0.022 | 0.022 | |
| D-24/23 | ≤0.035 | 0.020 | 0.024 |
| Thickness | Properties | Unit | Test | Standard | FormulaB | FormulaD |
|---|---|---|---|---|---|---|
| 0.16mm | Mini Bending Strength (LW) | psi | A | ≥60000 | 91622 | 95489 |
| E-1/150 T150 | ≥30000 | 38754 | 34230 | |||
| Mini Bending Strength (CW) | psi | A | ≥50000 | 87687 | 96372 |
| Thickness | Properties | Unit | Test | Standard | Formula B | Formula D |
|---|---|---|---|---|---|---|
| 0.16mm | Absorption rate | % | D1-24/23 | ≤0.25 | 0.16 | 0.18 |
| 0.32mm | Absorption rate | % | D1-24/23 | ≤0.15 | 0.09 | 0.09 |
When JS-A23 is used together with ADP or DOPO, great synergistic effects were observed. JS-A23 also makes it much easier to mix the flame retardants with the adhesives.
20 kg/bucket. The samples can be packaged as customers' requirements.
* The data recommended in this document can be used as a reference for various purposes. The content may be revised in response to new technological improvements. Therefore, when designing the product, the usage environment and structure of the product must be fully considered, and whether the product will encounter various problems should be determined by the design company itself.
Product TDS and SDS Files: